Cochlear and NXP Semiconductors collaborate to produce IC devices
for advanced hearing implants
20 October 2009
Cochlear Limited and NXP
Semiconductors have signed an agreement for
the design and manufacturing of IC devices for Cochlear’s future
generation of implantable hearing devices.
The agreement includes the definition, development and supply of
ultra low power speech processor and wireless communication ICs to be
used in Cochlear’s next generation products.
“NXP and Cochlear teams have been working together successfully for
several years and our complementary strengths have been key to the
development of our market leading implantable hearing solutions,” says
Jan Janssen, Senior Vice President, Design & Development at Cochlear.
This new agreement extends the partnership into the development and
manufacturing of our wireless communication technology even further
which is a key component of our future technology developments."
“We are proud to contribute our Ultra Low Power Magnetic Induction
Wireless and CoolFlux DSP technology to enable Cochlear’s industry
leading Hearing Implant solutions,” says Rene Penning de Vries, NXP CTO.
“This long-term partnership with Cochlear is another example of NXP’s
strategy to achieve leadership in High Performance Mixed Signal
application domains. It also illustrates NXP’s engagement in the medical
domain, where we target new applications such as wireless (implanted)
sensors, medical body area networks and personal healthcare devices.”